Semiconductor manufacturing equipment

We propose equipment that matches the products and inspection items we handle, centering on the inspection taping equipment that is the final process.

Inspection taping/storage devices Model : MAG Series

  • Pick up diced wafers and chip components, inspect their appearance and electrical characteristics, and then collect the good products.
  • It also supports damage-free positioning by complete non-contact positioning through image processing.
  • Various feeding and collection methods are available, including wafer ring, tray, and tape.
Model MAG-PT MAG-ST MAG-TT MAG-VI MAG-IT
Machine cycle time 10.0pcs/sec* 3pcs/sec 1.6pcs/sec 5pcs/sec 1.5pcs/sec
Target workpiece, size WLCSP、LED、IC、Electronic Components WLCSP、LED、IC、Electronic Components Electronic Components Electronic Components Electronic Components
Product supply method Wafer ring type Wafer ring type Tray type Parts feeder type Parts feeder type
Collection method Taping type Tray type Tray type Box type Taping type
Positioning system Image recognition  or  4 way movable guide
Inspection/measurement functions ** Appearance inspection function (Cracks、Chipping、Mixture of different species、Ink mark、With or without bumps, etc) Electrical characteristics test function
Option Mapping functions support、Laser marking installation support、Tray supply and retrieval unit、Compatible with tape feeder units、Toothless processing function for workpiece supply tray is supported、Support for processing to prevent lot configuration errors、Operation management・Data management support.
Primary power / Air source 3 phase AC200V, 50/60Hz /  0.4MPa or 0.5MPa
Control system Programmable Logic Controller

* This does not include wafer ring exchange time, etc.
** The inspection and measurement functions are optional. Please select one if necessary.

LED taping device

  • LED chips supplied in bulk form are inspected for electrical characteristics, polarity matching, unidirectionality, etc., and then inserted into the carrier tape.
  • Posture and flaws are determined by image inspection from the top side of the product in the carrier tape, and only good products are reeled in with the cover tape thermally compressed.
  • After inserting the tape, the system automatically replaces the products that do not meet the image inspection requirements.
Model MAG-LED 3 iMAG
Machine cycle time 10pcs/sec 8pcs/sec
Target workpiece, size Top view LED & Lens Type Top view LED Top view LED & Side view LED (dual use possible)
Product supply method Parts feeder type
Collection method Taping type
Positioning system - -
Inspection/measurement function Image inspection station、Kelvin Contact、Integrating sphere
Option After inserting the tape, the system automatically replaces the products that do not meet the image inspection requirements、Positioning mechanism during measurement、Compliance with CE Mark
Primary power / Air source Single phase AC 200~240V 50/60Hz / 0.4MPa or 0.5MPa
Control system Programmable Logic Controller

Refill taping device

  • This equipment sequentially removes taped chips that have become fractional during the production process, and after image inspection, refills them with new embossed tape.
Model ERM
Machine cycle time 1pcs/sec
Target workpiece, size WLCSP, IC, electronic components
Product supply method Tape feeder type
Collection method Taping type
Positioning system Image recognition  or  4-way movable guide
Inspection/measurement function Appearance inspection function (Cracks, chips, mixed species, ink marks, presence of unevenness, external dimensions, etc.)
Option Support for external import of log data、Post-seal product presence detection mechanism、Ionizer installation support
Primary power / Air source 3 phase AC200V, 50/60Hz /  ― MPa
Control system Programmable Logic Controller